Type：Load board
Layer：34L
THK:4.75mm Raw material:IT-180A
Ratio：32:1
Finished size：430X435 mm
Finished: Gold plating, Hard gold (AU 50u")
Space between BGA pad and line：3.5 mil
Hard gold pitch：4 mil
Impedance tolerance：±5
Vias to circuits: 4.8 mil
Min drilling size：0.15 mm
Vias technology：Epoxy fillings + POFV
